The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7866376 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 11, 2011

Filed:

Oct. 29, 2007
Applicants:

Lei Jiang, Shenzhen, CN;

Dong-bo Zheng, Shenzhen, CN;

Meng Fu, Shenzhen, CN;

Chun-chi Chen, Taipei Hsien, TW;

Inventors:

Lei Jiang, Shenzhen, CN;

Dong-Bo Zheng, Shenzhen, CN;

Meng Fu, Shenzhen, CN;

Chun-Chi Chen, Taipei Hsien, TW;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tucheng, Taipei County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); H05K 7/20 (2006.01); H01L 23/34 (2006.01); F28F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation device includes a base for contacting an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, including a first transferring portion thermally engaging with the base and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe includes an evaporation portion thermally engaging with the base and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set.


Find Patent Forward Citations

Jiang, Lei. (2011). Heat dissipation device with u-shaped and s-shaped heat pipes (U.S. Patent No. 7866376). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7866376

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