The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
May. 15, 2006
Chun-chi Chen, Tu Cheng, TW;
Shi-wen Zhou, Shenzhen, CN;
Meng Fu, Shenzhen, CN;
Dong-bo Zheng, Shenzhen, CN;
Chun-Chi Chen, Tu Cheng, TW;
Shi-Wen Zhou, Shenzhen, CN;
Meng Fu, Shenzhen, CN;
Dong-Bo Zheng, Shenzhen, CN;
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
A heat dissipation device includes a primary heat sink () contacting a central processing unit and a secondary heat sink () attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base () and a heat-dissipation portion () disposed on a middle of the base. The secondary heat sink includes a substrate () and a plurality of fin assemblies () arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile