Don Templeton

Title: **Don Templeton: Innovator in Integrated Circuit Packaging**

Introduction

Don Templeton, a prominent inventor based in Santa Clara, CA, has made significant contributions to the field of integrated circuit (IC) packaging. With a total of five patents to his name, Templeton’s work focuses on innovative methodologies that enhance the performance and reliability of IC packages.

Latest Patents

Among his latest patents is a novel design that compensates for die-substrate coefficient of thermal expansion (CTE) mismatch at reflow temperatures. This patent describes an IC package containing an integrated circuit die with a major surface and several solder bumps situated in at least one corner region of that surface. The die faces a substrate surface equipped with bump pads. Notably, the design maintains a footprint area of at least 400 mm and establishes a CTE ratio of at least 3:1 between the substrate and the die, emphasizing the critical improvements in manufacturing methodologies.

Another significant invention by Templeton is the concept of package-level power gating. This innovative die package allows for the isolation of power domains within the chip by eliminating vias within the package substrate. This design flexibility enables multiple substrate configurations without the need for specific vias, thereby freeing up die area for additional functional logic, which is a considerable advantage for PCB designers.

Career Highlights

Templeton currently works at Nvidia Corporation, a leader in graphics and computing technology. His ongoing efforts in the development of advanced IC packaging reflect his commitment to pushing the boundaries of technology. Throughout his career, he has paved the way for innovations that simplify design processes while enhancing performance.

Collaborations

Throughout his professional journey, Don Templeton has worked alongside esteemed colleagues such as Jayprakash Chipalkatti and Zuhair Bokharey. These collaborations have played a crucial role in driving forward the research and development of advanced IC packaging solutions that are paramount in modern electronics.

Conclusion

In summary, Don Templeton stands out as a significant figure in the field of integrated circuit packaging. His inventive solutions are not only a testament to his expertise but also play an essential role in the continual evolution of electronics. As technologies advance, the impact of Templeton’s inventions will undoubtedly influence future innovations in the industry.