The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Jan. 26, 2018
Applicant:

Nvidia Corporation, Santa Clara, CA (US);

Inventors:

Jim Dobbins, Santa Clara, CA (US);

Sheetal Jain, Santa Clara, CA (US);

Don Templeton, Santa Clara, CA (US);

Yaping Zhou, Santa Clara, CA (US);

Wenjun Shi, Santa Clara, CA (US);

Sunil Sudhakaran, Santa Clara, CA (US);

Assignee:

NVIDIA CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 21/48 (2006.01); H03H 7/42 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4846 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/5222 (2013.01); H03H 7/425 (2013.01); H01L 23/49866 (2013.01); H01L 2223/6605 (2013.01); H01L 2223/6661 (2013.01);
Abstract

Systems and methods that facilitate resistance and capacitance balancing are presented. In one embodiment, a system comprises: a plurality of ground lines configured to ground components; and a plurality of signal bus lines interleaved with the plurality of ground lines, wherein the interleaving is configured so that plurality of signal bus lines and plurality of ground lines are substantially evenly spaced and the plurality of signal bus lines convey a respective plurality of signals have similar resistance and capacitance constants that are balanced. The plurality of signals can see a substantially equal amount ground surface and have similar amounts of capacitance. The plurality of signal bus lines can have similar cross sections and lengths with similar resistances. The plurality of signal bus lines interleaved with the plurality of ground lines can be included in a two copper layer interposer design with one redistribution layer (RDL).


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