Baguio, Philippines

Dolores Babaran Milo

This inventor holds 21 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Packaging. Top assignee: Texas Instruments Corporation. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dolores Babaran Milo. Retrieved from https://idiyas.com/inventor/dolores-babaran-milo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 21 

% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 2

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 2017-2026

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Areas of Expertise:
Electronic Package
Interconnect
IC Package
Bump Joint
Lead Frame
Die Singulation
Molding
QFN Pin Routing
BGA Design
Stabilizing Leads
Substrate
Transport Packaging
21 patents (USPTO):Explore Patents

Title: Innovations by Dolores Babaran Milo in Semiconductor Packaging

Introduction: Dolores Babaran Milo is a prominent inventor based in Baguio, Philippines, recognized for his significant contributions to the field of semiconductor packaging. With a remarkable total of 19 patents, his innovative approaches have pushed the boundaries of technology in electronic devices.

Latest Patents: Among his latest advancements is the patent titled "Bump to Package Substrate Solder Joint," which details a method for assembling flip-chip semiconductor packages. This method involves placing a semiconductor die onto bonding features of a package substrate, utilizing arc welding to create a solder connection through melted solder paste. Another notable patent is the "Lead Frame for a Die," which describes a semiconductor device design featuring a silicon die with a metal material coating mounted on a lead frame. The innovative structure aims to ensure that the metal coating does not contact the lead frame, thereby enhancing device reliability.

Career Highlights: Dolores is currently affiliated with Texas Instruments Corporation, a leading technology company known for its semiconductor innovations. His role at the company involves driving research and development efforts in packaging technologies, where he applies his expertise to create efficient and reliable semiconductor solutions.

Collaborations: Throughout his career, Dolores has collaborated with talented professionals in the industry, including his coworkers Michael Flores Milo and Cherry Lyn Marquez Aranas. Their collective efforts underline the importance of teamwork in fostering innovation and advancing technology.

Conclusion: Dolores Babaran Milo's contributions to the semiconductor industry reflect a deep commitment to innovation and a forward-thinking approach to technology. With 19 patents to his name, he has established himself as a significant figure in enhancing the efficiency and effectiveness of electronic devices, paving the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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