The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Feb. 25, 2020
Texas Instruments Incorporated, Dallas, TX (US);
Dolores Babaran Milo, Baguio, PH;
Cherry Lyn Marquez Aranas, Pampanga, PH;
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
In a described example, a method for making a packaged semiconductor device includes laser ablating a first groove with a first width and a first depth into a mounting surface of a substrate between landing pads. A first pillar bump on an active surface of a semiconductor device is bonded to a first landing pad; and a second pillar bump on the semiconductor device is bonded to a second landing pad. A channel forms with the active surface of the semiconductor device forming a first wall of the channel, the first pillar bump forms a second wall of the channel, the second pillar bump forming a third wall of the channel, and a surface of the first groove forms a fourth wall of the channel. The channel is filled with mold compound and at least a portion of the substrate and the semiconductor device are covered with mold compound.