The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Nov. 29, 2021
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Ruby Ann Merto Camenforte, Mabalacat, PH;
Floro Lopez Camenforte, Mabalacat, PH;
Dolores Babaran Milo, Baguio, PH;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49582 (2013.01); H01L 21/4828 (2013.01); H01L 23/3121 (2013.01); H01L 23/49586 (2013.01); H01L 23/544 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 2223/54413 (2013.01); H01L 2224/10175 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48996 (2013.01);
Abstract
An integrated circuit (IC) package includes an interconnect comprising patches of unoxidized metal that are circumscribed by a region of roughened metal formed of oxidized metal. The IC package also includes a die mounted on the interconnect. The die is conductively coupled to at least a subset of the patches of unoxidized metal.