The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

May. 10, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 70/04 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/657 (2026.01); H10W 70/041 (2026.01); H10W 70/042 (2026.01); H10W 70/047 (2026.01); H10W 70/048 (2026.01); H10W 70/65 (2026.01); H10W 74/016 (2026.01); H10W 74/114 (2026.01); H10W 90/701 (2026.01);
Abstract

An electronic package includes an electronic component including terminals, a plurality of leads, at least some of the leads being electrically coupled to the terminals within the electronic package, and a mold compound covering the electronic component and partially covering the leads. Each of the leads include an exposed bottom face coplanar with a bottom surface of the mold compound and an exposed end face coplanar with one of a plurality of side surfaces of the mold compound. For at least some of the leads, the exposed end face includes a narrow portion forming a concave recess, the narrow portion being between top and bottom edges of the exposed end face.


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