The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Apr. 27, 2022
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/16 (2013.01); H01L 24/75 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75253 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/812 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/8191 (2013.01);
Abstract
A method of assembling a flipchip semiconductor package, includes placing a semiconductor die having circuitry electrically coupled to bond pads with bumps having solder paste thereon onto bonding features of a package substrate. Arc welding is used using an arc welding apparatus including a biased electrode having a tip spaced apart from the solder paste, wherein electrical current generated by the arc welding melts the solder paste to provide a solder connection.