Baguio, Philippines

Michael Flores Milo

USPTO Granted Patents = 6 

Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2017-2025

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6 patents (USPTO):Explore Patents

Title: Michael Flores Milo: Innovator in Semiconductor Packaging

Introduction

Michael Flores Milo is a distinguished inventor based in Baguio, Philippines. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His innovative approaches have advanced the technology used in electronic devices, showcasing his expertise and dedication to the industry.

Latest Patents

Among his latest patents is the "Bump to package substrate solder joint," which describes a method of assembling a flip-chip semiconductor package. This method involves placing a semiconductor die with circuitry onto bonding features of a package substrate, utilizing arc welding to create a solder connection. Another notable patent is the "Leadframe with ground pad cantilever," which details an electronic device that includes a die attach pad and a set of cantilevered leads for down bond connections. This invention enhances the efficiency and reliability of semiconductor devices.

Career Highlights

Michael Flores Milo is currently employed at Texas Instruments Corporation, where he continues to innovate and develop new technologies. His work has not only contributed to the company's success but has also influenced the broader semiconductor industry. His commitment to excellence is evident in the quality and impact of his inventions.

Collaborations

Michael has collaborated with talented individuals such as Dolores Babaran Milo and Ernesto Pentecostes Rafael, Jr. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Michael Flores Milo is a prominent figure in the semiconductor industry, known for his innovative patents and contributions to technology. His work at Texas Instruments Corporation and collaborations with fellow inventors highlight his commitment to advancing the field. His inventions continue to shape the future of electronic devices, making a lasting impact on the industry.

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