Texas Instruments Corporation

Michael Flores Milo

Dolores Babaran Milo

Ernesto Pentecostes Rafael, Jr

Allen Dee

A method of assembling a flipchip semiconductor package, includes placing a semiconductor die having circuitry electrically coupled to bond pads with bumps having solder paste thereon onto bonding features of a package substrate. Arc welding is used using an arc welding apparatus including a biased electrode having a tip spaced apart from the solder paste, wherein electrical current generated by the arc welding melts the solder paste to provide a solder connection.

Bump to package substrate solder joint

An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

Leadframe with ground pad cantilever

A gang clip includes a plurality of clips formed from a metal each having a center region oriented along a first plane and an angled clip foot having a foot height, a length and a bend angle sufficient to electrically contact a lead terminal of the leadframe to be used to form a device. Adjacent ones of the plurality of clips are joined to one another by a first tie bar also oriented along the first plane. The first tie bar extends to a saw street region located between adjacent ones of the clips. A second tie bar attached to the first tie bar is positioned in the saw street region.

Split tie bar for clip stability

An integrated circuit (IC) chip socket that can include a non-conductive housing and moveable pogo pins positioned within the non-conductive housing. The moveable pogo pins can include active pogo pins, each active pogo pin being positioned to a corresponding lead of an IC chip insertable into the IC chip socket. Moveable pogo pins can also include an inactive pogo pin positioned to avoid contacting each lead of the IC chip insertable into the IC chip socket.

Integrated circuit (IC) chip socket

An improved BGA spring probe pin with a spring actuated solder ball receptacle that grips the sides of the solder ball during probing. A method of operating a BGA prober with improved BGA spring probe pins.

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Baguio, Philippines

Michael Flores Milo