Singapore, Singapore

Dexter Inciong Reynoso

This inventor holds 8 USPTO granted patents and 5 published patent applications. Top assignees: Infineon Technologies Ag, St Assembly Test Services Inc., Infineon Technologies Austria Ag. Active years: 2003-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dexter Inciong Reynoso. Retrieved from https://idiyas.com/inventor/dexter-inciong-reynoso

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 8 

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2003-2026

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8 patents (USPTO):Explore Patents

Title: The Innovations of Dexter Inciong Reynoso

Introduction

Dexter Inciong Reynoso is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on enhancing the efficiency and reliability of semiconductor packages.

Latest Patents

One of his latest patents is for a molded semiconductor package with high voltage isolation. This innovative package includes a semiconductor die attached to a substrate, featuring a bond pad on the first side that faces away from the substrate. An insulating layer covers this side, while an electrical conductor is attached to a part of the bond pad exposed by an opening in the insulating layer. The mold compound encases the semiconductor die, and an electrically insulative material fills the opening, effectively sealing the exposed part of the bond pad. This design ensures that the mold compound is separated from the bond pad, enhancing the package's performance. Another significant patent involves pre-molded lead frames for semiconductor packages. This design includes a mold body with a first main surface and a second main surface, along with a plurality of recesses and first leads that extend from the mold body.

Career Highlights

Throughout his career, Dexter has worked with prominent companies in the semiconductor industry, including Infineon Technologies AG and ST Assembly Test Services Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Dexter has collaborated with talented individuals such as Shao Ping Wan and Eric Brion Acquitan. These partnerships have fostered a creative environment that has led to the development of advanced semiconductor solutions.

Conclusion

Dexter Inciong Reynoso's contributions to semiconductor technology are noteworthy, with a focus on innovative designs that improve performance and reliability. His patents reflect a commitment to advancing the field, making him a significant figure in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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