The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
Sep. 30, 2019
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Balehithlu Manjappaiah Upendra, Singapore, SG;
Dexter Reynoso, Singapore, SG;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/41 (2013.01); H01L 24/35 (2013.01); H01L 24/38 (2013.01); H01L 24/40 (2013.01); H01L 24/84 (2013.01); H01L 23/49555 (2013.01); H01L 23/49568 (2013.01); H01L 2224/358 (2013.01); H01L 2224/38 (2013.01); H01L 2224/4099 (2013.01); H01L 2224/40105 (2013.01); H01L 2224/40175 (2013.01); H01L 2224/41051 (2013.01); H01L 2224/41175 (2013.01); H01L 2224/84007 (2013.01); H01L 2224/84986 (2013.01);
Abstract
A multi-clip structure includes a first clip for die bonding and a second clip for die bonding. The multi-clip structure further includes a retaining tape fixed to the first clip and to the second clip to hold the first clip and the second clip together.