The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2003
Filed:
Sep. 11, 2000
Applicant:
Inventors:
Assignee:
St Assembly Test Service Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 3/102 ;
U.S. Cl.
CPC ...
G01R 3/102 ;
Abstract
A new ground land is provided on the BGA package that allows for increasing the test sensitivity of a wire bond tester. The ground land is interconnected with a ground ring that is provided in the immediate vicinity of the BGA device. The ground land of the invention is provided such that the location of the ground land does not unduly interfere with essential functions and locations of other components that are required for the mounting of the BGA device, most preferably in a corner of the BGA device package.
Quick Actions:
Reynoso, Dexter. (2003). Ground land for singulated ball grid array (U.S. Patent No. 6597188). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6597188
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile