Fremont, CA, United States of America

Deviprasad Malladi

This inventor holds 20 USPTO granted patents and 1 published patent application, primarily in Thermal Management. Top assignees: Sun Microsystems, Inc., Oracle America, Inc.. Active years: 1994-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Deviprasad Malladi. Retrieved from https://idiyas.com/inventor/deviprasad-malladi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20 

% Patents Active = 95.0

Average Co-Inventor Count = 2.2

ph-index = 10

Forward Citations = 342(Granted Patents)


Location History:

  • Campbell, CA (US) (1994 - 2003)
  • Freemont, CA (US) (2011)
  • Fremont, CA (US) (2003 - 2012)

Company Filing History:


Years Active: 1994-2012

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Areas of Expertise:
Thermal Management
EMI Shielding
Integrated Circuit Packaging
Heat Spreader
Multi-Chip Package
Debug System
Soft Error Rates
On-Chip Bypass Capacitor
Thermally Efficient
Thin Film Capacitor
Surface Mountable Semiconductor
Cooling Solutions
20 patents (USPTO):Explore Patents

Title: **Deviprasad Malladi: A Pioneer in Thermal Management Innovations**

Introduction

Deviprasad Malladi, based in Fremont, CA, is a prolific inventor with an impressive portfolio of 20 patents to his name. His contributions primarily focus on thermal management technologies, which play a crucial role in enhancing the performance and longevity of electronic devices.

Latest Patents

Among his latest innovations is the "Optimized lid attach process for thermal management and multi-surface compliant heat removal." This invention outlines a sophisticated approach to managing heat through a multi-surface compliant heat removal process. It includes identifying components that will share a heat-rejecting device, applying non-adhesive film to these components, and strategically applying phase change material. This phase change material is positioned on top of the non-adhesive film, ensuring optimal thermal conductivity. Furthermore, the process incorporates steps to facilitate the effective removal and reattachment of the heat-rejecting device, enhancing the overall efficiency of thermal management systems.

Career Highlights

Deviprasad's career includes significant tenures at renowned companies such as Sun Microsystems, Inc. and Oracle America, Inc. Throughout his journey, he has been integral to various projects aimed at improving electronic device functionality, always pushing the boundaries of innovation.

Collaborations

Deviprasad has collaborated with esteemed professionals in the field, including his coworkers Vadim Gektin and Shahid S Ansari. These collaborations have played a vital role in nurturing innovative ideas and refining the applications of their technological advancements.

Conclusion

Deviprasad Malladi stands out as a distinguished inventor whose work in thermal management is paving the way for future innovations. With a substantial number of patents and ongoing collaborations, his impact within the field continues to grow, shaping the trajectory of technology in electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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