The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 1998

Filed:

May. 14, 1996
Applicant:
Inventors:

Deviprasad Malladi, Campbell, CA (US);

Douglas W Forehand, Mountain View, CA (US);

Assignee:

Sun Microsystems, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257712 ; 257713 ; 257467 ; 361719 ; 165 802 ;
Abstract

A structure and method for controlling the junction temperature of a semiconductor chip in an electronic system. A temperature sensing device and the chip whose junction temperature is to be monitored are located adjacent to one another on the same interconnect structure. A thermally conductive lid can also be attached to the interconnect structure, thereby enclosing the temperature sensing device and the chip within in a closed cavity. Dedicated pins extend from the temperature sensing device through the interconnect structure, for connection to a temperature control circuit. By locating the temperature sensing device on the same interconnect structure as the chip, and within a common enclosure, the temperature sensed by the temperature sensing device is an accurate representation of the actual junction temperature of the chip. By obtaining an improved reading of the actual junction temperature, the operation of the temperature control circuit can be optimized.


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