The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2003

Filed:

Jul. 30, 1999
Applicant:
Inventors:

Deviprasad Malladi, Campbell, CA (US);

Renukanthan Raman, Los Altos, CA (US);

Christopher D. Furman, Gilroy, CA (US);

Assignee:

Sun Microsystems, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 3/100 ;
U.S. Cl.
CPC ...
G01R 3/100 ;
Abstract

A method for performing electrical acceptance tests on a sub-system including a test substrate, a microprocessor and one or more associated computer components, such as SRAM, DRAM and ROM. A pin grid array, ball grid array, line grid array or equivalent test connector system is provided that allows direct addressing of selected circuits of the microprocessor and of each associated component. The microprocessor plus substrate are first tested together. If this test is successful, the associated components are then added, preferably one at a time, and the new sub-system is tested. If a particular sub-system fails a test, the cause(s) of failure can be isolated and removed, where possible, and the modified sub-system can be retested.


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