The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2002
Filed:
May. 07, 1996
Deviprasad Malladi, Campbell, CA (US);
Sun Microsystems, Inc., Mountain View, CA (US);
Abstract
A method and apparatus for packaging an electronic device, such as an integrated circuit chip ( ), includes an intermediate device carrier ( ) with a substantially planar upper surface ( ) and a plurality of bonding pads ( ) for coupling the carrier to the integrated circuit chip. A ceramic ring ( ) is attached to the upper surface of the device carrier and a thermally conductive cover plate ( ) is attached to the ceramic ring to form an inner cavity for receiving the chip therein. The ceramic ring comprises a material with a coefficient of thermal expansion substantially similar to or as the same as the device carrier to minimize stress therebetween during thermal expansion or contraction of the package device. The thermally conductive cover plate provides a path for dissipating heat generated during electrical operations of the chip.