IDiyas

For the Inventor, By the Inventor

Essex Junction, VT, United States of America

Dennis R Conti

USPTO Granted Patents = 13 

Average Co-Inventor Count = 4.2

ph-index = 4

Forward Citations = 163(Granted Patents)


Company Filing History:

goldMedal13 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1988-2023

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13 patents (USPTO):
1. 11561243 - Compliant organic substrate assembly for rigid probes (2023-01-24),
2. 11322473 - Interconnect and tuning thereof (2022-05-03),
3. 11029334 - Low force wafer test probe (2021-06-08),
4. 11009545 - Integrated circuit tester probe contact liner (2021-05-18),
5. 10670653 - Integrated circuit tester probe contact liner (2020-06-02),
6. 10663487 - Low force wafer test probe with variable geometry (2020-05-26),
7. 10444260 - Low force wafer test probe (2019-10-15),
8. 10261108 - Low force wafer test probe with variable geometry (2019-04-16),
9. 9152517 - Programmable active thermal control (2015-10-06),
10. 7265561 - Device burn in utilizing voltage control (2007-09-04),
11. 6847203 - Applying parametric test patterns for high pin count ASICs on low pin count testers (2005-01-25),
12. 6275051 - Segmented architecture for wafer test and burn-in (2001-08-14),
13. 4751656 - Method for choosing replacement lines in a two dimensionally redundant (1988-06-14),

Title: The Innovative Mind of Dennis R. Conti

Introduction

Dennis R. Conti is an accomplished inventor based in Essex Junction, Vermont, with a remarkable portfolio comprising 13 patents. His contributions to the field of electrical engineering and microcircuit technology have paved the way for advancements in various industries. As a key member of the International Business Machines Corporation (IBM), Conti has showcased his ingenuity and expertise through his latest inventions.

Latest Patents

Among Conti's recent patents is the **Compliant Organic Substrate Assembly for Rigid Probes**. This innovative wafer test device introduces a first and second laminate structure designed to interface seamlessly with microcircuits. A unique feature of this device is the compliant layer, composed of an elastomer that allows for movement within a limited range, enhancing the device's functionality.

Another notable patent is the **Interconnect and Tuning Thereof**. This invention details a method for optimizing an interconnect that links integrated circuits or laminate structures. The technique includes determining the necessary compression for a spring within a compliant layer, balancing path length to improve both current-carrying capacity and signal speed. Such innovations significantly contribute to advancements in microelectronic systems.

Career Highlights

Dennis R. Conti has accumulated numerous accolades during his tenure at IBM. His work focuses on the intersection of mechanical compliance and electrical performance, leading to breakthroughs in testing methodologies for semiconductor devices. Conti’s keen insight into the engineering challenges faced in the industry has solidified his reputation as a leading inventor.

Collaborations

Throughout his career, Conti has collaborated with notable colleagues such as David Michael Audette and Grant W. Wagner. These partnerships have fostered a collaborative environment that encourages innovative thought and the sharing of expertise in developing cutting-edge technologies.

Conclusion

Dennis R. Conti's contributions as an inventor are invaluable. His innovative patents have not only advanced the field of electrical engineering but have also enhanced the capabilities of microcircuit technologies. As part of the dynamic team at IBM, Conti continues to inspire future generations of inventors and engineers through his work and collaborative efforts.

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