The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Sep. 12, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

David Audette, Colchester, VT (US);

Grant Wagner, Jericho, VT (US);

Marc Knox, Hinesburg, VT (US);

Dennis Conti, Essex Junction, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 21/75 (2013.01); H01L 23/00 (2006.01); G06F 30/394 (2020.01);
U.S. Cl.
CPC ...
H01L 24/33 (2013.01); G06F 30/394 (2020.01); H01L 24/83 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01029 (2013.01);
Abstract

Aspects of the invention include a method of tuning an interconnect that couples a first structure that is a first integrated circuit or a first laminate structure to a second structure that is a second integrated circuit or a second laminate structure. The method includes obtaining a compression requirement for a spring in a compliant layer of the interconnect. A longer path length of the spring leads to greater compression and mechanical support. Current and signal speed requirements for the interconnect are obtained. A shorter path length of the spring leads to greater current-carrying capacity and greater signal speed. Specifications for the spring are determined based on the compression requirement and the current and signal speed requirements. Determining the specifications includes determining a number of active coils of the spring to be less than two.


Find Patent Forward Citations

Loading…