The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2023
Filed:
Sep. 12, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
David Audette, Colchester, VT (US);
Grant Wagner, Jericho, VT (US);
Marc Knox, Hinesburg, VT (US);
Dennis Conti, Essex Junction, VT (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); H01R 13/24 (2006.01); H01R 43/00 (2006.01); H01R 43/20 (2006.01); H01R 13/03 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0735 (2013.01); H01R 13/03 (2013.01); H01R 13/2421 (2013.01); H01R 13/2464 (2013.01); H01R 43/007 (2013.01); H01R 43/20 (2013.01);
Abstract
A wafer test device and methods of assembling a wafer test device involve a first laminate structure, and a second laminate structure arranged to interface with a microcircuit of the wafer. The wafer test device includes a compliant layer between the first laminate structure and the second laminate structure. The compliant layer includes an elastomer that exhibits compliance within a limited range of movement.