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For the Inventor, By the Inventor

Singapore, Singapore

David Daycock

USPTO Granted Patents = 10 

Average Co-Inventor Count = 4.7

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Woodhaven, SG (2021 - 2023)
  • Singapore, SG (2023 - 2024)

Company Filing History:

goldMedal5 out of 37,905 
 
Micron Technology Incorporated
 patents
where one patent can have more than one assignee

Years Active: 2021-2025

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10 patents (USPTO):
1. 12266630 - Bond pad connection layout (2025-04-01),
2. 12010836 - Memory arrays and methods used in forming a memory array comprising strings of memory cells and operative through-array-vias (2024-06-11),
3. 11967556 - Methods for fabricating microelectronic devices with contacts to conductive staircase steps, and related devices and systems (2024-04-23),
4. 11876068 - Bond pad connection layout (2024-01-16),
5. 11791202 - Memory arrays and methods used in forming a memory array comprising strings of memory cells (2023-10-17),
6. 11672114 - Memory arrays and methods used in forming a memory array comprising strings of memory cells (2023-06-06),
7. 11641742 - Memory arrays and methods used in forming a memory array comprising strings of memory cells (2023-05-02),
8. 11417681 - Memory arrays and methods used in forming a memory array comprising strings of memory cells and operative through-array-vias (2022-08-16),
9. 11152388 - Memory arrays and methods used in forming a memory array comprising strings of memory cells (2021-10-19),
10. 10985179 - Memory arrays and methods used in forming a memory array comprising strings of memory cells and operative through-array-vias (2021-04-20),

Title: David Daycock: Innovator in Semiconductor Technology

Introduction

David Daycock is a prominent inventor based in Singapore, known for his significant contributions to semiconductor technology. With a total of 10 patents to his name, Daycock has made remarkable advancements in memory device design and manufacturing processes.

Latest Patents

Among his latest patents is the innovative "Bond pad connection layout," which describes a memory device that includes a package substrate and at least one stack of semiconductor dies. These dies can be arranged in a shingled configuration, featuring slits that separate memory planes into logic blocks. This design enhances the efficiency of memory arrays. Another notable patent involves methods for forming memory arrays comprising strings of memory cells and operative through-array-vias (TAVs). This method includes creating a stack of insulative and conductive tiers, which optimizes the performance of memory-cell strings.

Career Highlights

David Daycock is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work focuses on developing advanced memory technologies that push the boundaries of current capabilities. His innovative designs have contributed to the evolution of memory devices, making them more efficient and reliable.

Collaborations

Throughout his career, Daycock has collaborated with notable colleagues, including Matthew J King and Prakash Rau Mokhna Rau. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

David Daycock's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the future of memory devices and their applications in various industries.

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