The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

May. 13, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

David Daycock, Singapore, SG;

Prakash Rau Mokhna Rau, Boise, ID (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 41/27 (2023.01); H01L 21/28 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H10B 41/10 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H10B 41/27 (2023.02); H01L 21/31111 (2013.01); H01L 21/32133 (2013.01); H01L 29/40114 (2019.08); H01L 29/40117 (2019.08); H10B 41/10 (2023.02); H10B 43/10 (2023.02); H10B 43/27 (2023.02);
Abstract

A method used in forming a memory array comprising strings of memory cells and operative through-array-vias (TAVs) comprises forming a stack comprising vertically-alternating insulative tiers and conductive tiers. The stack comprises a TAV region and an operative memory-cell-string region. Operative channel-material strings are formed in the stack in the operative memory-cell-string region and dummy channel-material strings are formed in the stack in the TAV region. At least a majority of channel material of the dummy channel-material strings is replaced in the TAV region with insulator material and operative TAVs are formed in the TAV region. Other methods and structures independent of method are disclosed.


Find Patent Forward Citations

Loading…