David A Ruben

This inventor holds 66 USPTO granted patents and 14 published patent applications and 17 EPO patents, primarily in Hermetic Packaging (CPC class H05K). Top assignees: Medtronic, Inc., Corning Incorporated. Active years: 1996-2026.

USPTO Granted Patents = 66 (Patent Applications = 14)

% Patents Active = 90.9

EPO Patents = 17 (Patent Applications = 23)

Average Co-Inventor Count = 2.4

ph-index = 16

Forward Citations = 997(Granted Patents)

Forward Citations (Not Self Cited) = 830(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Redwood Shores, CA (US) (1996)
Mesa, AZ (US) (1996 - 2024)

Company Filing History:

where one patent can have more than one assignee

Years Active: 1996-2026

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Areas of Expertise:

Hermetic Assembly

Sealed Package

Power Source

Nano-Scale Diffusion

Implantable Medical Device

Feedthrough Assembly

Surface Texturing

Nuclear Radiation Converter

Electronic Device

Pressure Sensor

Laser Cutting

Wafer-Scale Package

66 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12610487 - Sealed package including electronic device and power source (2026-04-21),

2. 12454117 - Kinetically limited nano-scale diffusion bond structures and methods (2025-10-28),

3. 12233477 - Hermetic assembly and device including same (2025-02-25),

4. 12082354 - Electronic package and device including same (2024-09-03),

5. 11999014 - Laser cutting system (2024-06-04),

6. 11969821 - Surface texturing using energy pulses (2024-04-30),

7. 11950387 - Methods for forming hermetically-sealed packages including feedthrough assemblies (2024-04-02),

8. 11881325 - Nuclear radiation particle power converter (2024-01-23),

9. 11865639 - Hermetic assembly and device including same (2024-01-09),

10. 11744518 - Sealed package and method of forming same (2023-09-05),

11. 11725995 - Pressure sensor assembly for use in implantable medical device including a substrate having via that extends through substrate along via axis between first major surface and second major surface of substrate (2023-08-15),

12. 11548092 - Surface texturing using energy pulses (2023-01-10),

13. 11485670 - Hermetic conductive feedthroughs for a semiconductor wafer (2022-11-01),

14. 11419552 - Sealed package and method of forming same (2022-08-23),

15. 11189390 - Power source and method of forming same (2021-11-30),

Title: The Innovative Journey of David A. Ruben

Introduction: David A. Ruben, a talented inventor based in Mesa, AZ (US), has made significant contributions to the field of innovations with his creative mindset and dedication to problem-solving.

Latest Patents: David A. Ruben holds several patents in various industries, showcasing his versatility and ingenuity in inventing new solutions to complex challenges.

Career Highlights: Throughout his career, David A. Ruben has demonstrated a keen ability to identify gaps in the market and develop groundbreaking inventions that have the potential to change the way we live and work.

Collaborations: David A. Ruben has collaborated with leading research institutions, universities, and companies to bring his inventions to life, highlighting his collaborative spirit and commitment to driving innovation forward.

Conclusion: David A. Ruben's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a respected inventor in Mesa, AZ (US) and beyond, leaving a lasting impact on the world of inventions.