The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Nov. 04, 2019
Applicant:
Medtronic, Inc., Minneapolis, MN (US);
Inventors:
David A. Ruben, Mesa, AZ (US);
Michael S. Sandlin, Chandler, AZ (US);
Assignee:
Medtronic, Inc., Minneapolis, MN (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03B 23/20 (2006.01); H05K 5/00 (2006.01); A61N 1/375 (2006.01); H01L 23/057 (2006.01); H01L 23/10 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
C03B 23/20 (2013.01); A61N 1/3754 (2013.01); B81C 1/00301 (2013.01); H01L 23/057 (2013.01); H01L 23/10 (2013.01); H05K 5/0095 (2013.01); A61N 1/3756 (2013.01); B81B 2207/095 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.