The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Dec. 10, 2020
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

David A. Ruben, Mesa, AZ (US);

Andreas Fenner, Chandler, AZ (US);

Andrew J. Ries, Lino Lakes, MN (US);

Robert A. Munoz, Andover, MN (US);

Christopher T. Kinsey, Bethel, MN (US);

Mark E. Henschel, Phoenix, AZ (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/20 (2014.01); B23K 26/32 (2014.01); A61N 1/39 (2006.01); A61N 1/375 (2006.01);
U.S. Cl.
CPC ...
B23K 26/206 (2013.01); A61N 1/3754 (2013.01); A61N 1/3968 (2013.01); B23K 26/32 (2013.01);
Abstract

Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.


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