The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Aug. 10, 2022
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

David A. Ruben, Mesa, AZ (US);

Craig L. Schmidt, Eagan, MN (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/06 (2006.01); H05K 5/02 (2006.01); A61B 5/00 (2006.01); A61N 1/375 (2006.01); A61N 1/372 (2006.01); A61B 5/0245 (2006.01); A61N 1/05 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01); H05K 5/03 (2006.01);
U.S. Cl.
CPC ...
A61B 5/686 (2013.01); A61B 5/0245 (2013.01); A61N 1/05 (2013.01); A61N 1/372 (2013.01); A61N 1/3754 (2013.01); H05K 1/115 (2013.01); H05K 1/183 (2013.01); H05K 3/0017 (2013.01); H05K 3/32 (2013.01); H05K 3/4038 (2013.01); H05K 5/0247 (2013.01); H05K 5/03 (2013.01); H05K 5/066 (2013.01); H05K 5/069 (2013.01); A61N 1/37512 (2017.08); A61N 2001/37294 (2013.01); H05K 2201/09036 (2013.01);
Abstract

Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.


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