Darryl Kuo

Title: The Innovative Contributions of Darryl Kuo

Introduction

Darryl Kuo is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on enhancing the performance and efficiency of semiconductor components.

Latest Patents

One of Darryl Kuo's latest patents is titled "Semiconductor component having through-silicon vias." This invention describes a semiconductor component that includes a substrate with an opening. The component features a first dielectric liner within the opening, characterized by varying thicknesses at both ends and a specific ratio of these thicknesses. Additionally, a second dielectric liner is placed over the first, also with varying thicknesses and a greater ratio. Another notable patent is "Method of making a semiconductor component having through-silicon vias." This method involves etching a substrate to create an opening, followed by the deposition of a first dielectric liner with a defined stress. A second dielectric liner is then deposited, with its stress direction opposing that of the first, culminating in the deposition of a conductive material.

Career Highlights

Darryl Kuo is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading firm in the semiconductor industry. His innovative work has positioned him as a key figure in advancing semiconductor technologies.

Collaborations

Darryl has collaborated with notable colleagues, including Chen-Hua Douglas Yu and Cheng-Hung Chang. Their combined expertise contributes to the ongoing advancements in semiconductor research and development.

Conclusion

Darryl Kuo's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to pave the way for future innovations in semiconductor components.