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For the Inventor, By the Inventor

Mahopac, NY, United States of America

Daniel Lawrence Ostapko

USPTO Granted Patents = 13

Average Co-Inventor Count = 2.5

ph-index = 6

Forward Citations = 106(Granted Patents)


Location History:

  • Poughkeepsie, NY (US) (1976 - 1977)
  • Yorktown Heights, NY (US) (1985)
  • Mahopac, NY (US) (1999 - 2011)

Company Filing History:

goldMedal13 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1976-2011

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13 patents (USPTO):
1. 7870531 - System for using partitioned masks to build a chip (2011-01-11),
2. 7469401 - Method for using partitioned masks to build a chip (2008-12-23),
3. 7302671 - Integrated circuit logic with self compensating shapes (2007-11-27),
4. 7269817 - Lithographic process window optimization under complex constraints on edge placement (2007-09-11),
5. 7084476 - Integrated circuit logic with self compensating block delays (2006-08-01),
6. 6430731 - Methods and apparatus for performing slew dependent signal bounding for signal timing analysis (2002-08-06),
7. 6383847 - Partitioned mask layout (2002-05-07),
8. 6144224 - Clock distribution network with dual wire routing (2000-11-07),
9. 5994924 - Clock distribution network with dual wire routing (1999-11-30),
10. 4559611 - Mapping and memory hardware for writing horizontal and vertical lines (1985-12-17),
11. 4029970 - Changeable decoder structure for a folded logic array (1977-06-14),
12. 4025799 - Decoder structure for a folded logic array (1977-05-24),
13. 3958110 - Logic array with testing circuitry (1976-05-18),

Title: The Innovative Contributions of Daniel Lawrence Ostapko

Introduction

Daniel Lawrence Ostapko is a notable inventor based in Mahopac, NY (US). He has made significant contributions to the field of technology, particularly in chip design and manufacturing. With a total of 13 patents to his name, Ostapko's work has had a considerable impact on the industry.

Latest Patents

Ostapko's latest patents include a "System for using partitioned masks to build a chip" and a "Method for using partitioned masks to build a chip." Both patents focus on a mask reuse methodology process that implements soft logic with a generic array type cell structure mask and a custom blocking mask. The system comprises a mask set with reusable masks corresponding to hard intellectual property (IP) components, a generic array type cell mask, and a custom blocking mask that includes blocking regions corresponding to IP components printed on a die. The method involves printing component cores onto a die at predetermined locations using a reusable mask set, superimposing masks, and printing generic array type cells onto the die while excluding the locations of the component cores.

Career Highlights

Ostapko is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work at IBM has allowed him to explore various aspects of chip design and manufacturing, contributing to the company's reputation as a leader in the tech industry.

Collaborations

Throughout his career, Ostapko has collaborated with talented individuals such as Jin-Fuw Lee and Fook-Luen Heng. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Daniel Lawrence Ostapko's contributions to the field of technology, particularly in chip design, are noteworthy. His innovative patents and work at IBM highlight his commitment to advancing the industry. His collaborations with other professionals further enhance the impact of his inventions.

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