Company Filing History:
3 out of 1,709 
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Years Active: 1990-2012
Title: Exploring the Innovations of Daniel DeLessert
Introduction
Daniel DeLessert, an inventive mind based in Newberg, Oregon, has made significant contributions to the field of technology, particularly in electrical engineering. With a portfolio of six patents, his work focuses on sophisticated methods for connecting coaxial cables to printed circuit boards (PCBs), addressing the intricacies of high-density signal interfaces.
Latest Patents
DeLessert's latest patents encompass innovative approaches to building interface modules that facilitate the connection between coaxial cables and PCBs. One notable patent includes a method for constructing an interface module that features a signal via and multiple ground vias. This method incorporates back drilling techniques to create a center conductor hole and a shield opening, enhancing the electrical isolation between these components. Another significant invention by DeLessert includes an interface module designed for connecting a multitude of signal paths to high signal density interfaces, integrating plated receptacles and effective ground vias for optimized performance.
Career Highlights
Throughout his career, DeLessert has collaborated with esteemed companies including The Whitaker Corporation and Teradyne, Inc. His experience in these organizations has allowed him to refine his expertise in developing cutting-edge electrical solutions that meet the demands of modern electronics.
Collaborations
Throughout his journey, DeLessert has partnered with skilled professionals such as Michael L. Demeter and Scott S. Corbett III. These collaborations have contributed to the development of his patents and enriched his innovative approaches to engineering challenges.
Conclusion
Daniel DeLessert stands out as a prominent inventor in the realm of electrical engineering. His six patents reflect his ongoing commitment to advancing technology in connector interfaces. As he continues to push the boundaries of innovation, DeLessert’s work will likely play a significant role in shaping the future of electronic connectivity.