The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2012

Filed:

Dec. 04, 2008
Applicants:

Roya Yaghmai, Los Angeles, CA (US);

Frank B. Parrish, Simi Valley, CA (US);

Daniel Delessert, Newberg, OR (US);

Inventors:

Roya Yaghmai, Los Angeles, CA (US);

Frank B. Parrish, Simi Valley, CA (US);

Daniel DeLessert, Newberg, OR (US);

Assignee:

Tyco Electronics Corporation, Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H05K 3/26 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one implementation, a method is provided for constructing an interface module which includes constructing a board having a signal via through the board, and having at least one ground via extending through the board. The method further includes back drilling the signal via to create a center conductor hole above a remaining portion of the signal via and back drilling a shield opening in the board and at least part way into the at least one ground via such that a height of the center conductor hole is reduced. The method further includes plating the shield opening and the center conductor hole, and back drilling to remove a portion of the plating to electrically isolate the plated shield opening and the plated center conductor hole.


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