The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Dec. 04, 2008
Roya Yaghmai, Los Angeles, CA (US);
Frank B. Parrish, Simi Valley, CA (US);
Daniel Delessert, Newberg, OR (US);
Roya Yaghmai, Los Angeles, CA (US);
Frank B. Parrish, Simi Valley, CA (US);
Daniel DeLessert, Newberg, OR (US);
Teradyne, Inc., North Reading, MA (US);
Abstract
In one embodiment, an interface module is provided for connecting a plurality of signal paths to a high signal density interface. The interface module includes a board having axial conductor receptacles. The axial conductor receptacles have at least one ground via extending through the board to an interface side of the board and a shield receiving hole in the board extending into the board from a cable side of the board. At least a portion of the at least one ground via being exposed within the shield receiving hole, the shield receiving hole having a plating therein contacting the portion of the at least one ground via exposed within the shield receiving hole. The axial conductor receptacles have a plated center conductor receiving hole in the board, which extends to a signal via. The signal via extends from the center conductor hole to the interface side of the board. A non-plated hole in the board is located between the plated center conductor hole and the shield receiving hole.