This inventor holds 4 USPTO granted patents and 5 published patent applications. Top assignees: Dexerials Corporation, Lintec Corporation. Active years: 2017-2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017-2023
Title: Daichi Mori: Innovator in Semiconductor Technology
Introduction
Daichi Mori is a prominent inventor based in Tochigi, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His innovative work focuses on thermosetting adhesive sheets and methods for manufacturing semiconductor devices.
Latest Patents
Mori's latest patents include a thermosetting adhesive sheet and a semiconductor device manufacturing method. The first patent describes a thermosetting adhesive sheet designed to reduce semiconductor wafer warping and chipping. This adhesive sheet features a thermosetting adhesive layer made from a resin composition that includes an epoxy compound and a curing agent. The specific formulation ensures a total value obtained by multiplying the reciprocal of the epoxy equivalent of the epoxy compound by the content of the epoxy compound in the resin component being 1.15E-04 or more. Additionally, the blending amount of the filler is set at 50 parts by mass or more with respect to 100 parts by mass of the resin component. The adhesive sheet is applied to the ground surface of a semiconductor and cured before dicing.
The second patent also focuses on a thermosetting adhesive sheet and a method for manufacturing a semiconductor device. This invention aims to further reduce semiconductor wafer warping and chipping. The adhesive layer contains a resin component and a filler, with the resin component comprising a (meth)acrylate and a polymerization initiator. The formulation specifies that the content of the solid (meth)acrylate in the resin component must be 55 wt % or more. Furthermore, the total value obtained by multiplying the number of functional groups per unit molecular weight of the (meth)acrylate by the content of the (meth)acrylate in the resin component must be 2.7E-03 or more. The blending amount of the filler is set between 80 to 220 parts by mass with respect to 100 parts by mass of the resin component.
Career Highlights
Throughout his career, Daichi Mori has worked with notable companies in the semiconductor industry, including Dexerials Corporation and Lintec Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in adhesive technology.
Collaborations
Mori has collaborated with various professionals in his field, including his coworker Tomoyuki Ishimatsu. Their joint efforts have contributed to advancements
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile