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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10192769 B1

PDFFull Text
Date of Patent:
Jan. 29, 2019

Filed:

Mar. 29, 2016

Thermosetting adhesive sheet and semiconductor device manufacturing method

Applicant:

Dexerials Corporation, Tokyo, JP;

Inventor:

Daichi Mori, Tochigi, JP;

Assignee:

DEXERIALS CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Asok K Sarkar

Int. Cl.
CPC ...
H01L 21/683 (2006.01); C09J 133/10 (2006.01); C09J 133/00 (2006.01); H01L 21/304 (2006.01); C09J 133/08 (2006.01); H01L 21/78 (2006.01); C09J 4/00 (2006.01); C09J 7/35 (2018.01); C09J 7/10 (2018.01); C09J 11/04 (2006.01); C08K 5/00 (2006.01); C08K 5/14 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 4/00 (2013.01); C09J 7/10 (2018.01); C09J 7/35 (2018.01); C09J 133/00 (2013.01); C09J 133/08 (2013.01); C09J 133/10 (2013.01); H01L 21/304 (2013.01); H01L 21/683 (2013.01); H01L 21/78 (2013.01); C08K 5/0025 (2013.01); C08K 5/14 (2013.01); C09J 11/04 (2013.01); C09J 2201/61 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2433/00 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing warping of a semiconductor wafer are provided. The thermosetting adhesive sheet is to be applied to a grinding-side surface of a semiconductor wafer and cured before dicing and includes a polymer containing an elastomer, a (meth) acrylate containing more than 95% wt of a polyfunctional (meth) acrylate with respect to total (meth)acrylate content, an organic peroxide having a one-minute half-life temperature of 130° C. or lower, and a transparent filler. Thereby, the thermosetting adhesive sheet significantly shrinks and generates a stress opposing a warp direction of the semiconductor wafer, enabling the semiconductor wafer to be maintained in a flat state.

Find Patent Forward Citations

Mori, Daichi. (2019). Thermosetting adhesive sheet and semiconductor device manufacturing method (U.S. Patent No. 10192769). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10192769

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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