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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11624011 B1

PDFFull Text
Date of Patent:
Apr. 11, 2023

Filed:

Dec. 13, 2016

Thermosetting adhesive sheet and semiconductor device manufacturing method

Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Daichi Mori, Tochigi, JP;

Tomoyuki Ishimatsu, Tochigi, JP;

Assignee:

LINTEC CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Jasper Saberi

Int. Cl.
CPC ...
B32B 9/04 (2006.01); C09J 163/00 (2006.01); C09J 7/10 (2018.01); H01L 23/00 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 11/08 (2006.01); H01L 21/304 (2006.01); C09J 7/30 (2018.01); B32B 27/06 (2006.01); H01L 21/683 (2006.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); B32B 9/04 (2013.01); B32B 27/06 (2013.01); C09J 7/10 (2018.01); C09J 7/30 (2018.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 11/08 (2013.01); H01L 21/304 (2013.01); H01L 21/6836 (2013.01); H01L 23/562 (2013.01); B32B 2457/14 (2013.01); C08K 3/013 (2018.01); C09J 2203/326 (2013.01); C09J 2301/408 (2020.08); C09J 2400/22 (2013.01); C09J 2463/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E−04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

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