The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
Dec. 13, 2016
Dexerials Corporation, Shinagawa-ku, Tokyo, JP;
Daichi Mori, Tochigi, JP;
Tomoyuki Ishimatsu, Tochigi, JP;
DEXERIALS CORPORATION, Tokyo, JP;
Abstract
Provided are a thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing semiconductor wafer warping and chipping. The thermosetting adhesive sheet includes a thermosetting adhesive layer containing a resin component and a filler, the resin component containing a (meth)acrylate and a polymerization initiator, the (meth)acrylate containing a solid (meth)acrylate and a trifunctional or higher functional (meth)acrylate, content of the solid (meth)acrylate in the resin component being 55 wt % or more; a total value obtained by multiplying the number of functional groups per unit molecular weight of the (meth)acrylate by content of the (meth)acrylate in the resin component being 2.7E-03 or more, and blending amount of the filler being 80 to 220 pts. mass with respect to 100 pts. mass of the resin component.