Da-Jung Chen

This inventor holds 46 USPTO granted patents and 1 published patent application, primarily in Electronic Packaging. Top assignees: Cyntec Company, Cyntec Co., Ltd.. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Da-Jung Chen. Retrieved from https://idiyas.com/inventor/da-jung-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 46 (Patent Applications = 1)

% Patents Active = 97.8

Average Co-Inventor Count = 3.0

ph-index = 6

Forward Citations = 110(Granted Patents)

Location History:

Sanhe Village, TW (2009)
Hsinchu, TW (2015)
Taoyuan, TW (2004 - 2023)
Taoyuan County, TW (2005 - 2023)

Company Filing History:

Years Active: 2004-2026

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Areas of Expertise:

Electronic Module

Stacked Structure

Three-Dimensional Package

Heat Dissipation

Transformer

Power Conversion

Metal Core PCB

Inductive Element

MOSFET Pair

Chip Package

Electrical Connections

Manufacturing Method

46 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12568582 - Electronic module (2026-03-03),

2. 12219708 - Electronic module (2025-02-04),

3. 12094644 - Electronic structure having a transformer (2024-09-17),

4. 11848146 - Stacked electronic module and method to make the same (2023-12-19),

5. 11744009 - Electronic module (2023-08-29),

6. 11651890 - Electronic structure having a transformer (2023-05-16),

7. 11153973 - Electronic module (2021-10-19),

8. 11031255 - Stack frame for electrical connections and the method to fabricate thereof (2021-06-08),

9. 11017934 - Electronic module (2021-05-25),

10. 10991681 - Three-dimensional package structure (2021-04-27),

11. 10741531 - Method to form a stacked electronic structure (2020-08-11),

12. 10593656 - Three-dimensional package structure (2020-03-17),

13. 10593561 - Stack frame for electrical connections and the method to fabricate thereof (2020-03-17),

14. 10199361 - Stacked electronic structure (2019-02-05),

15. 10034379 - Stacked electronic structure (2018-07-24),

Title: The Innovative Journey of Da-Jung Chen

Introduction: Da-Jung Chen, a visionary inventor hailing from Taoyuan County, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Da-Jung Chen's latest patents include a cutting-edge smart home automation system that integrates AI technology for enhanced efficiency and convenience, as well as a revolutionary medical device aimed at improving patient care and outcomes.

Career Highlights: With a career spanning over two decades, Da-Jung Chen has established himself as a pioneer in the tech industry. His innovative solutions have garnered international recognition and have been instrumental in shaping the future of various sectors.

Collaborations: Da-Jung Chen has collaborated with leading tech companies and research institutions to further develop and implement his inventions. His partnerships have led to the successful integration of his technologies into everyday applications, benefiting countless individuals worldwide.

Conclusion: Da-Jung Chen's relentless pursuit of innovation and his passion for creating solutions that make a difference have solidified his reputation as a trailblazer in the world of technology. His continued dedication to pushing the boundaries of what is possible ensures that his legacy will endure for years to come.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: