The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
May. 12, 2021
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Da-Jung Chen, Taoyuan County, TW;
Chien Ming Chen, Hsinchu County, TW;
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01F 27/24 (2006.01); H01F 27/02 (2006.01); H01F 27/26 (2006.01); H01F 41/00 (2006.01); H01L 25/16 (2023.01); H01L 49/02 (2006.01); H01F 27/36 (2006.01); H01F 41/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01F 27/022 (2013.01); H01F 27/24 (2013.01); H01F 27/266 (2013.01); H01F 27/2804 (2013.01); H01F 27/288 (2013.01); H01F 27/2823 (2013.01); H01F 27/363 (2020.08); H01F 41/005 (2013.01); H01F 41/02 (2013.01); H01F 41/04 (2013.01); H01L 25/16 (2013.01); H01L 28/10 (2013.01);
Abstract
A stacked electronic module includes a magnetic device comprising a magnetic body with electrodes of the magnetic device being disposed on a top and bottom surface of the magnetic body, wherein a molding body encapsulates the magnetic body, wherein conductive layers are disposed on a top and bottom surface of the molding body for electrically connected to the electrodes of the magnetic device.