Cyntec Company

Da-Jung Chen

Bau-Ru Lu

Chun-Tiao Liu

Yi-Cheng Lin

Chau-Chun Wen

Chi-Feng Huang

Jeng-Jen Li

Han-Hsiang Lee

Kaipeng Chiang

Chun Hsien Lu

Tsung-Chan Wu

Chun-Hsien Lu

Chun-Liang Lin

Chin-Hsiung Liao

Chau Chun Wen

Chien Ming Chen

Kai-Peng Chiang

Wen-Hsiung Liao

Chun-Fu Hu

Huei-Ren You

Yu-Chao Fang

Pei-Chun Hung

Yi-Tsung Chen

Yi-Min Fang

Chih-Chan Day

Cheng Chieh Hsu

Tung-Yi Yang

Steven Liu

An electronic module, comprising an inductor, a first circuit board, and a second circuit board, wherein the first circuit board is disposed on a lateral surface of the body of the inductor with at least one electronic device being disposed on the first circuit board, wherein the second circuit board is disposed under the body of the inductor and electrically connected to the inductor.

Electronic module

An electronic structure comprising: a circuit board, wherein electronic devices and a transformer are disposed on the circuit board, wherein the transformer comprises a first coil, a second coil, and a magnetic body comprising a pillar with at least one portion of the pillar being disposed in a through-opening of the circuit board, wherein the first coil is wound around an upper portion of the pillar and the second coil is wound around a lower portion of the pillar for forming the transformer.

Electronic structure having a transformer

A stacked electronic module includes a magnetic device comprising a magnetic body with electrodes of the magnetic device being disposed on a top and bottom surface of the magnetic body, wherein a molding body encapsulates the magnetic body, wherein conductive layers are disposed on a top and bottom surface of the molding body for electrically connected to the electrodes of the magnetic device.

Stacked electronic module and method to make the same

An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

An electronic structure comprises: a circuit board, wherein a plurality of electronic devices and a transformer are disposed on the circuit board, the transformer comprises a first coil, a second coil, and a magnetic body, wherein a molding body encapsulates at least one portion of the outer surface of the first coil, at least one portion of the outer surface of the second coil, and the plurality of electronic devices for electrically isolating the plurality of electronic devices from the transformer.

A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

Stack frame for electrical connections and the method to fabricate thereof

The present invention discloses an electronic module. The electronic module comprises: a substrate, having a top surface and a bottom surface; a plurality of coils on the top surface of the substrate, wherein each coil comprises a corresponding first end and a corresponding second end; and a molding body, disposed on the substrate to encapsulate said coils, wherein said corresponding first end and said corresponding second end of each coil are electrically coupled to a corresponding first electrode and a corresponding second electrode of the electronic module.

A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The three-dimensional package structure is applicable to a POL, (Point of Load) converter.

Three-dimensional package structure

A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar without using any substrate.

Method to form a stacked electronic structure

A package structure comprises: a plurality of metal parts, wherein each metal part is made of metal and each two adjacent metal parts are spaced apart by a gap being filled with an insulating material; a first insulating layer, disposed over a top of the plurality of metal parts and the top surface of a conductive element; and a first conductive layer, disposed over the first insulating layer, wherein a first conductive pattern electrically connects a first terminal of the conductive element to a first metal part through at least one first via disposed in the first insulating layer, wherein a bump is disposed in the first insulating layer and electrically connected to a second terminal of the conductive element.

The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.

A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.

Stacked electronic structure

A stacked electronic structure is provided. The stacked electronic structure includes: a magnetic device, electronic devices, and a substrate. The substrate is disposed under the magnetic device. First and second electronic devices are disposed between a bottom surface of the magnetic device and a top surface of the substrate. The first and second electronic devices comprise first and third terminals, disposed on first and second surfaces thereof, respectively, electrically connected to the magnetic device without using the substrate. The first and second electronic devices also comprise second and fourth terminals, disposed on second and fourth surfaces thereof, respectively, electrically connected to the substrate.

A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer over the top surface or the bottom surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

Growing community of inventors

Taoyuan County, Taiwan

Da-Jung Chen