The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Dec. 25, 2018
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H05K 1/181 (2013.01); H05K 1/188 (2013.01); H05K 3/3405 (2013.01); H05K 3/3421 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H05K 3/284 (2013.01); H05K 2201/086 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10515 (2013.01); H05K 2203/0415 (2013.01);
Abstract
A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar without using any substrate.