The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Dec. 08, 2017
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/02 (2006.01); H01F 27/28 (2006.01); H01F 41/00 (2006.01); H01F 27/32 (2006.01); H01F 27/36 (2006.01); H01F 27/24 (2006.01); H01F 17/04 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01F 27/022 (2013.01); H01F 17/04 (2013.01); H01F 27/24 (2013.01); H01F 27/28 (2013.01); H01F 27/2823 (2013.01); H01F 27/32 (2013.01); H01F 27/36 (2013.01); H01F 41/00 (2013.01); H05K 1/111 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 1/115 (2013.01); H05K 2201/041 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01);
Abstract
The present invention discloses an electronic module. The electronic module comprises: a substrate, having a top surface and a bottom surface; a plurality of coils on the top surface of the substrate, wherein each coil comprises a corresponding first end and a corresponding second end; and a molding body, disposed on the substrate to encapsulate said coils, wherein said corresponding first end and said corresponding second end of each coil are electrically coupled to a corresponding first electrode and a corresponding second electrode of the electronic module.