Morgan Hill, CA, United States of America

Cynthia Blair

This inventor holds 11 USPTO granted patents and 3 published patent applications and 1 EPO patent. Top assignees: Infineon Technologies Ag, Ericsson Gmbh, Cree Gmbh. Active years: 2001-2022.

USPTO Granted Patents = 11 (Patent Applications = 3)

% Patents Active = 100.0

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 2.0

ph-index = 4

Forward Citations = 33(Granted Patents)

Company Filing History:

6 out of 15,016

Infineon Technologies Ag

Years Active: 2001-2022

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11437362 - Multi-cavity package having single metal flange (2022-09-06),

2. 10468399 - Multi-cavity package having single metal flange (2019-11-05),

3. 8299856 - Power transistor output match network with high Q RF path and low Q low frequency path (2012-10-30),

4. 8258014 - Method of manufacturing a power transistor module and package with integrated bus bar (2012-09-04),

5. 7994630 - Power transistor package with integrated bus bar (2011-08-09),

6. 7902939 - Stripline balun (2011-03-08),

7. 7728671 - Semiconductor power device with bias circuit (2010-06-01),

8. 6573796 - Automatic LDMOS biasing with long term hot carrier compensation (2003-06-03),

9. 6404022 - AM/PM non-linearities in FETs (2002-06-11),

10. 6304129 - Compensation circuit and method for a power transistor (2001-10-16),

11. 6177834 - Output matched LDMOS power transistor device (2001-01-23),

Title: The Innovative Journey of Cynthia Blair

Introduction

Cynthia Blair is a prominent inventor based in Morgan Hill, CA (US). She has made significant contributions to the field of technology, particularly in the development of multi-cavity packages. With a total of 11 patents to her name, her work has had a substantial impact on the industry.

Latest Patents

Cynthia's latest patents include innovative designs for multi-cavity packages featuring a single metal flange. One of her notable inventions involves a multi-cavity package that includes a circuit board attached to the first main surface of the single metal flange. This design incorporates a plurality of openings that expose different regions of the flange, allowing for enhanced functionality. Another patent describes a similar multi-cavity package that integrates semiconductor dies within the openings of the circuit board, showcasing her expertise in creating efficient electronic components.

Career Highlights

Throughout her career, Cynthia has worked with leading companies in the technology sector, including Infineon Technologies AG and Ericsson GmbH. Her experience in these organizations has allowed her to refine her skills and contribute to groundbreaking projects.

Collaborations

Cynthia has collaborated with talented individuals such as Saurabh Goel and Alexander Komposch, further enhancing her innovative capabilities and expanding her professional network.

Conclusion

Cynthia Blair's contributions to the field of technology through her patents and collaborations highlight her as a significant figure in innovation. Her work continues to influence the development of advanced electronic components, showcasing her dedication to progress in the industry.