The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Mar. 31, 2015
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Saurabh Goel, San Jose, CA (US);

Alexander Komposch, Morgan Hill, CA (US);

Cynthia Blair, Morgan Hill, CA (US);

Cristian Gozzi, Santa Clara, CA (US);

Assignee:

CREE, INC., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 25/00 (2006.01); H01L 23/66 (2006.01); H01L 23/538 (2006.01); H01L 23/36 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 23/36 (2013.01); H01L 23/538 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49175 (2013.01);
Abstract

A multi-cavity package includes a single metal flange having first and second opposing main surfaces, a circuit board attached to the first main surface of the single metal flange, the circuit board having a plurality of openings which expose different regions of the first main surface of the single metal flange, and a plurality of semiconductor dies each of which is disposed in one of the openings in the circuit board and attached to the first main surface of the single metal flange. The circuit board includes a plurality of metal traces for electrically interconnecting the semiconductor dies to form a circuit. A corresponding method of manufacturing is also provided.


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