Location History:
- Campbell, CA (US) (2012 - 2015)
- San Jose, CA (US) (2018 - 2022)
Company Filing History:
7 out of 14,724 
3 out of 2,307 
1 out of 211 
Years Active: 2012-2022
Title: Saurabh Goel: Innovator in Multi-Cavity Package Technology
Introduction
Saurabh Goel is a prominent inventor based in Campbell, California. He has made significant contributions to the field of semiconductor packaging, holding a total of 11 patents. His innovative designs have advanced the technology used in multi-cavity packages, which are essential for modern electronic devices.
Latest Patents
One of Saurabh's latest patents is for a multi-cavity package featuring a single metal flange. This design includes a circuit board attached to the flange, which has multiple openings exposing different regions of the flange's surface. The circuit board also features a lateral extension that overhangs the flange. Another patent describes a similar multi-cavity package, which includes semiconductor dies disposed in the openings of the circuit board, electrically interconnected to form a circuit. These patents reflect his commitment to enhancing the efficiency and functionality of semiconductor packaging.
Career Highlights
Saurabh has worked with notable companies in the industry, including Infineon Technologies AG and Cree GmbH. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in semiconductor packaging.
Collaborations
Throughout his career, Saurabh has collaborated with talented professionals, including Richard Wilson and Haedong Jang. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Saurabh Goel's contributions to the field of semiconductor packaging through his innovative patents and collaborations highlight his role as a leading inventor. His work continues to influence the technology that powers modern electronics.