Clifford R Fishley

Title: The Innovative Contributions of Clifford R. Fishley

Introduction

Clifford R. Fishley is a notable inventor based in San Jose, California. He has made significant contributions to the field of integrated circuit packaging, holding a total of 6 patents. His work has advanced the technology used in high-speed input/output systems, showcasing his expertise and innovative spirit.

Latest Patents

Fishley's latest patents include a "Wire bond integrated circuit package for high speed I/O." This invention features a package substrate with a die attach pad for securing a die, a ground bonding ring for attaching core and I/O ground bond wires, and a first plurality of bond fingers for I/O signal bond wires. Another significant patent is the "Ball grid array package layout supporting many voltage splits and flexible split locations." This design includes ground paths, core paths, and input/output voltage paths, allowing for efficient routing of power and signals within the die package.

Career Highlights

Throughout his career, Fishley has worked with prominent companies such as LSI Logic Corporation and LSI Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the semiconductor industry.

Collaborations

Fishley has collaborated with talented individuals in his field, including Abiola A. Awujoola and Maurice O. Othieno. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Clifford R. Fishley's contributions to integrated circuit packaging have significantly impacted the industry. His innovative patents and collaborations reflect his dedication to advancing technology in high-speed systems.