The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2003
Filed:
Oct. 25, 2002
Clifford R. Fishley, San Jose, CA (US);
Maurice O. Othieno, Union City, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A heat spreader for use with an integrated circuit in a package, where the heat spreader is formed as a plate having a centrally disposed aperture with a diameter that is smaller than a minimum diameter of the integrated circuit. The heat spreader has an overall diameter that is no greater than a minimum diameter of the package. In this manner, the aperture in the heat spreader allows the plastic injected through a top gated mold form to pass through the heat spreader and more uniformly encapsulate the integrated circuit.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile