The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Feb. 21, 2008
Clifford R. Fishley, San Jose, CA (US);
Abiola Awujoola, Pleasanton, CA (US);
Leonard L. Mora, San Jose, CA (US);
Clifford R. Fishley, San Jose, CA (US);
Abiola Awujoola, Pleasanton, CA (US);
Leonard L. Mora, San Jose, CA (US);
LSI Corporation, Milpitas, CA (US);
Abstract
A die package generally including (A) ground paths routing a power ground from a ground power set of contact pads in a first conductive layer to a ground ring in a second conductive layer, (B) core paths routing a core voltage from a core power set of contact pads in the first conductive layer to a core ring in the second conductive layer, and (C) input/output voltage paths routing input/output voltages from an input/output power set of contact pads in the first conductive layer to an input/output ring in the second conductive layer, (i) the input/output ring surrounding the core ring, (ii) the ring being configured to power input and output circuits of the die, (iii) the input/output ring being split into ring segments isolated from each other and (iv) at least one particular ring segment having a length of less than a single connector pitch.