Company Filing History:
Years Active: 2002-2010
Title: The Innovative Contributions of Leonard Mora
Introduction
Leonard Mora is a notable inventor based in San Jose, California. He has made significant contributions to the field of integrated circuit packaging, holding a total of 6 patents. His work has been instrumental in advancing technology in high-speed input/output systems.
Latest Patents
Mora's latest patents include a "Wire bond integrated circuit package for high speed I/O." This innovative package features a substrate with a die attach pad, a ground bonding ring, and a plurality of bond fingers for efficient signal transmission. Another significant patent is the "Ball grid array package layout supporting many voltage splits and flexible split locations." This design enhances the routing of power and core voltages, allowing for improved performance in die packages.
Career Highlights
Throughout his career, Leonard Mora has worked with prominent companies such as LSI Logic Corporation and LSI Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the semiconductor industry.
Collaborations
Mora has collaborated with talented individuals, including Abiola A Awujoola and Abi Awujoola. These partnerships have fostered innovation and creativity in his projects.
Conclusion
Leonard Mora's contributions to integrated circuit packaging have had a lasting impact on the technology sector. His patents reflect a commitment to innovation and excellence in engineering.