The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Jun. 06, 2002
Leonard L. Mora, San Jose, CA (US);
Abi Awujoola, Union City, CA (US);
Leonard L. Mora, San Jose, CA (US);
Abi Awujoola, Union City, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A semiconductor substrate having high density signal routing is provided. The semiconductor substrate may include first signal traces electrically connected to a first row of signal bonding pads and routed on a first layer of the substrate. In addition, the substrate may include second signal traces electrically connected to a second row of signal bonding pads and routed on a second layer of the substrate. The first layer may be arranged in a strip line configuration, and the second layer may be arranged in a micro strip line configuration. Alternatively, the second signal traces may be arranged in a strip line configuration. In an embodiment, the first and second signal traces may be routed as differential pairs with approximately equal trace lengths. In another embodiment, all of the first and second signal traces may be routed as differential pairs.