Taichung, Taiwan

Chun-Yi Wu

This inventor holds 14 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Vanguard International Semiconductor Corporation, Industrial Technology Research Institute, Siliconware Precision Industries, Ltd.. Active years: 2000-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Yi Wu. Retrieved from https://idiyas.com/inventor/chun-yi-wu-o9p02pt5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 64.3

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 17(Granted Patents)


Location History:

  • Tainan City, TW (2000)
  • Kaohsiung Hsien, TW (2004)
  • Miaoli Hsien, TW (2011)
  • Taichung, TW (2009 - 2023)

Company Filing History:


Years Active: 2000-2026

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Areas of Expertise:
Electrical Detection
High-Efficiency Chip
Semiconductor Devices
Conductive Paste
Bonding Pad
Ultra-Wideband Antenna
Bicycle Hub
Clutch
Wheel Rim Frame
Dice Structure
Packaging Structure
High Electron Mobility Transistor
14 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Chun-Yi Wu

Introduction

Chun-Yi Wu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 14 patents. His work focuses on methods and structures that enhance the efficiency and functionality of electronic devices.

Latest Patents

Among his latest patents is a method of forming dice, which involves several steps. First, a wafer structure is provided, including a substrate and a stack of semiconductor layers disposed in die regions and a scribe line region. The substrate and the stack of semiconductor layers in the scribe line region are then removed to form a groove in the substrate. After the formation of the groove, the substrate is further thinned to obtain a reduced thickness. Finally, a separation process is performed on the substrate with the reduced thickness. Another notable patent is for a high-efficiency packaged chip structure and electronic device, which includes a substrate, a bottom conductive layer, a semiconductor layer, an interlayer dielectric layer, at least one electrode, and at least one top electrode. This innovative chip structure is designed to improve the performance of electronic devices.

Career Highlights

Chun-Yi Wu has worked with Vanguard International Semiconductor Corporation, where he has applied his expertise in semiconductor technology. His contributions have been instrumental in advancing the capabilities of the company's products.

Collaborations

Throughout his career, Chun-Yi Wu has collaborated with talented individuals such as Chih-Yen Chen and Wei-Chan Chang. These collaborations have fostered innovation and have led to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Chun-Yi Wu's innovative work in semiconductor technology has resulted in numerous patents that enhance electronic devices. His contributions continue to shape the future of the industry, making him a notable figure in the field of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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